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Nanomaterials Enable Smaller Chip Packaging

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Overwhelmingly, the focus for applying nanomaterials to electronics has been to meet the demands of Moore’s Law by continuing the seemingly inexorable shrinking of transistor dimensions.

While there have been some remarkable achievements in that regard—among them, getting dimensions down as low as 1 nanometer in the laboratory—the drive towards putting systems on chips (SoC) and systems in packages (SiP) is causing a shift in focus from smaller transistors to smaller packaging. This shift appears to be opening up a new use for nanomaterials that could expand the focus of nanomaterials in chip manufacturing.

The Swedish company Smoltek AB, a spinout from Chalmers University, sees chip packaging as the new frontier in nanoelectronics. It has been positioning itself at the forefront of this new movement over the last five years with its development of a variation on chemical vapor deposition (CVD) technology it has dubbed SMOLTEK TigerTM.